AR 10-HZL-TT
-
BRVN:BRVN-AR 10-HZL-TT
-
MPN:AR 10-HZL-TT
-
MFR:
-
Description:CONN IC DIP SOCKET 10POS GOLD
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
-
- Description: CONN IC DIP SOCKET 10POS GOLD
- Manufacturer: ASSMANN WSW Componets
- Length: 0 mm
- Series: -
- Product Status: Active
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Operating Temperature: -40°C ~ 105°C
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 10 (2 x 5)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Brass
-
- Datasheet: BRVN-AR 10-HZL-TT