AR 10-HZW/TN
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BRVN:BRVN-AR 10-HZW/TN
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MPN:AR 10-HZW/TN
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MFR:
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Description:CONN IC DIP SOCKET 4POS TIN
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: CONN IC DIP SOCKET 4POS TIN
- Manufacturer: ASSMANN WSW Componets
- Length: 0 mm
- Series: -
- Product Status: Active
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Operating Temperature: -40°C ~ 105°C
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 4 (2 x 2)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
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- Datasheet: BRVN-AR 10-HZW/TN