HSB02-101007

  • BRVN:
    BRVN-HSB02-101007
  • MPN:
    HSB02-101007
  • MFR:
  • Description:
    HEAT SINK, BGA, 10 X 10 X 7 MM
Datasheet

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  • Description: HEAT SINK, BGA, 10 X 10 X 7 MM
  • Manufacturer: CUI Devices
  • Length: 0 mm
  • Series: HSB
  • Product Status: Active
  • Type: Top Mount
  • Material: Aluminum Alloy
  • Shape: Square, Pin Fins
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Width: 0.394" (10.00mm)
  • Diameter: -
  • Fin Height: 0.275" (7.00mm)
  • Power Dissipation Temperature Rise: 2.0W @ 75°C
  • Thermal Resistance Forced Air Flow: 16.50°C/W @ 200 LFM
  • Thermal Resistance Natural: 37.90°C/W
  • Material Finish: Black Anodized