HSB15-404010
-
BRVN:BRVN-HSB15-404010
-
MPN:HSB15-404010
-
MFR:
-
Description:HEAT SINK, BGA, 40 X 40 X 10 MM
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
-
- Description: HEAT SINK, BGA, 40 X 40 X 10 MM
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSB
- Product Status: Active
- Type: Top Mount
- Material: Aluminum Alloy
- Shape: Square, Pin Fins
- Package Cooled: BGA
- Attachment Method: Adhesive
- Width: 1.575" (40.00mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation Temperature Rise: 6.3W @ 75°C
- Thermal Resistance Forced Air Flow: 3.90°C/W @ 200 LFM
- Thermal Resistance Natural: 11.84°C/W
- Material Finish: Black Anodized
-
- Datasheet: BRVN-HSB15-404010
