HSB27-434316
-
BRVN:BRVN-HSB27-434316
-
MPN:HSB27-434316
-
MFR:
-
Description:HEAT SINK, BGA, 43.1 X 43.1 X 16
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
-
- Description: HEAT SINK, BGA, 43.1 X 43.1 X 16
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSB
- Product Status: Active
- Type: Top Mount
- Material: Aluminum Alloy
- Shape: Square, Pin Fins
- Package Cooled: BGA
- Attachment Method: Adhesive
- Width: 1.697" (43.10mm)
- Diameter: -
- Fin Height: 0.650" (16.51mm)
- Power Dissipation Temperature Rise: 8.98W @ 75°C
- Thermal Resistance Forced Air Flow: 2.80°C/W @ 200 LFM
- Thermal Resistance Natural: 8.35°C/W
- Material Finish: Black Anodized
-
- Datasheet: BRVN-HSB27-434316
