HSE-B250-04H

  • BRVN:
    BRVN-HSE-B250-04H
  • MPN:
    HSE-B250-04H
  • MFR:
  • Description:
    HEAT SINK, EXTRUSION, TO-220, 25
Datasheet

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  • Description: HEAT SINK, EXTRUSION, TO-220, 25
  • Manufacturer: CUI Devices
  • Length: 0 mm
  • Series: HSE
  • Product Status: Active
  • Type: Board Level, Vertical
  • Material: Aluminum Alloy
  • Shape: Rectangular, Fins
  • Package Cooled: TO-220
  • Attachment Method: Bolt On and PC Pin
  • Width: 1.378" (35.00mm)
  • Diameter: -
  • Fin Height: 1.000" (25.40mm)
  • Power Dissipation Temperature Rise: 8.0W @ 75°C
  • Thermal Resistance Forced Air Flow: 3.26°C/W @ 200 LFM
  • Thermal Resistance Natural: 13.60°C/W
  • Material Finish: Black Anodized