HSE05-171933
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BRVN:BRVN-HSE05-171933
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MPN:HSE05-171933
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MFR:
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Description:HEAT SINK, EXTRUSION, TO-218/TO-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEAT SINK, EXTRUSION, TO-218/TO-
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSE
- Product Status: Active
- Type: Board Level
- Material: Aluminum Alloy
- Shape: Rectangular, Angled Fins
- Package Cooled: TO-218, TO-220
- Attachment Method: PC Pin
- Width: 0.669" (17.00mm)
- Diameter: -
- Fin Height: 1.280" (32.50mm)
- Power Dissipation Temperature Rise: 3.98W @ 75°C
- Thermal Resistance Forced Air Flow: 6.90°C/W @ 200 LFM
- Thermal Resistance Natural: 18.83°C/W
- Material Finish: Black Anodized
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- Datasheet: BRVN-HSE05-171933
