HSE06-503045
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BRVN:BRVN-HSE06-503045
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MPN:HSE06-503045
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MFR:
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Description:HEAT SINK, EXTRUSION, TO-218/TO-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEAT SINK, EXTRUSION, TO-218/TO-
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSE
- Product Status: Active
- Type: Board Level
- Material: Aluminum Alloy
- Shape: Rectangular, Fins
- Package Cooled: TO-218, TO-220
- Attachment Method: Clip
- Width: 1.181" (30.00mm)
- Diameter: -
- Fin Height: 1.772" (45.00mm)
- Power Dissipation Temperature Rise: 12.79W @ 75°C
- Thermal Resistance Forced Air Flow: 2.10°C/W @ 200 LFM
- Thermal Resistance Natural: 5.86°C/W
- Material Finish: Black Anodized
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- Datasheet: BRVN-HSE06-503045
