HSE08-505028
-
BRVN:BRVN-HSE08-505028
-
MPN:HSE08-505028
-
MFR:
-
Description:HEAT SINK, EXTRUSION, TO-218/TO-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
-
- Description: HEAT SINK, EXTRUSION, TO-218/TO-
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSE
- Product Status: Active
- Type: Board Level
- Material: Aluminum Alloy
- Shape: Rectangular, Angled Fins
- Package Cooled: TO-218, TO-220
- Attachment Method: Clip
- Width: 1.102" (28.00mm)
- Diameter: -
- Fin Height: 1.969" (50.00mm)
- Power Dissipation Temperature Rise: 10.53W @ 75°C
- Thermal Resistance Forced Air Flow: 2.70°C/W @ 200 LFM
- Thermal Resistance Natural: 7.13°C/W
- Material Finish: Black Anodized
-
- Datasheet: BRVN-HSE08-505028
