HSE11-B20-NP

  • BRVN:
    BRVN-HSE11-B20-NP
  • MPN:
    HSE11-B20-NP
  • MFR:
  • Description:
    HEAT SINK, EXTRUSION, TO-218/TO-
Datasheet

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  • Description: HEAT SINK, EXTRUSION, TO-218/TO-
  • Manufacturer: CUI Devices
  • Length: 0 mm
  • Series: HSE
  • Product Status: Active
  • Type: Top Mount
  • Material: Aluminum Alloy
  • Shape: Rectangular
  • Package Cooled: TO-218, TO-220
  • Attachment Method: Bolt On
  • Width: 0.472" (12.00mm)
  • Diameter: -
  • Fin Height: 0.177" (4.50mm)
  • Power Dissipation Temperature Rise: 1.93W @ 75°C
  • Thermal Resistance Forced Air Flow: 21.40°C/W @ 200 LFM
  • Thermal Resistance Natural: 38.90°C/W
  • Material Finish: Black Anodized