HSS-B20-085H

  • BRVN:
    BRVN-HSS-B20-085H
  • MPN:
    HSS-B20-085H
  • MFR:
  • Description:
    HEATSINK TO-220 3.4W ALUMINUM
Datasheet

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  • Description: HEATSINK TO-220 3.4W ALUMINUM
  • Manufacturer: CUI Devices
  • Length: 0 mm
  • Series: HSS
  • Product Status: Active
  • Type: Board Level
  • Material: Aluminum
  • Shape: Rectangular, Fins
  • Package Cooled: TO-220
  • Attachment Method: PC Pin
  • Width: 0.775" (19.68mm)
  • Diameter: -
  • Fin Height: 0.790" (20.00mm)
  • Power Dissipation Temperature Rise: 3.4W @ 75°C
  • Thermal Resistance Forced Air Flow: 7.46°C/W @ 200 LFM
  • Thermal Resistance Natural: 22.06°C/W
  • Material Finish: Black Anodized