HSS-C2540-SMT-TR
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BRVN:BRVN-HSS-C2540-SMT-TR
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MPN:HSS-C2540-SMT-TR
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MFR:
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Description:HEAT SINK TO-263 COPPER
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEAT SINK TO-263 COPPER
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSS
- Product Status: Active
- Type: Board Level
- Material: Copper
- Shape: Rectangular, Fins
- Package Cooled: TO-263 (D²Pak)
- Attachment Method: -
- Width: 1.000" (25.40mm)
- Diameter: -
- Fin Height: 0.450" (11.43mm)
- Power Dissipation Temperature Rise: 3.8W @ 75°C
- Thermal Resistance Forced Air Flow: 5.50°C/W @ 200 LFM
- Thermal Resistance Natural: 21.90°C/W
- Material Finish: Tin
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- Datasheet: BRVN-HSS-C2540-SMT-TR
