HSS-C2591-SMT-TR
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BRVN:BRVN-HSS-C2591-SMT-TR
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MPN:HSS-C2591-SMT-TR
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MFR:
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Description:HEAT SINK TO-263 COPPER
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEAT SINK TO-263 COPPER
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSS
- Product Status: Active
- Type: Top Mount
- Material: Copper
- Shape: Rectangular, Fins
- Package Cooled: TO-263 (D²Pak)
- Attachment Method: -
- Width: 1.020" (25.91mm)
- Diameter: -
- Fin Height: 0.375" (9.52mm)
- Power Dissipation Temperature Rise: 2.1W @ 75°C
- Thermal Resistance Forced Air Flow: 8.15°C/W @ 200 LFM
- Thermal Resistance Natural: 35.71°C/W
- Material Finish: Tin
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- Datasheet: BRVN-HSS-C2591-SMT-TR
