HSS06-C20-P32
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BRVN:BRVN-HSS06-C20-P32
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MPN:HSS06-C20-P32
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MFR:
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Description:HEAT SINK, STAMPING, TO-220, 27.


Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
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- Description: HEAT SINK, STAMPING, TO-220, 27.
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSS
- Product Status: Active
- Type: Board Level, Vertical
- Material: Copper Alloy
- Shape: Rectangular
- Package Cooled: TO-220
- Attachment Method: PC Pin
- Width: 0.866" (22.00mm)
- Diameter: -
- Fin Height: 0.375" (9.52mm)
- Power Dissipation Temperature Rise: 3.0W @ 75°C
- Thermal Resistance Forced Air Flow: 10.60°C/W @ 200 LFM
- Thermal Resistance Natural: 25.35°C/W
- Material Finish: Tin
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- Datasheet: BRVN-HSS06-C20-P32