HSS07-C20-P274
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BRVN:BRVN-HSS07-C20-P274
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MPN:HSS07-C20-P274
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MFR:
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Description:HEAT SINK, STAMPING, TO-220, 21.
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEAT SINK, STAMPING, TO-220, 21.
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSS
- Product Status: Active
- Type: Board Level, Vertical
- Material: Copper Alloy
- Shape: Rectangular
- Package Cooled: TO-220
- Attachment Method: PC Pin
- Width: 0.520" (13.21mm)
- Diameter: -
- Fin Height: 0.515" (13.08mm)
- Power Dissipation Temperature Rise: 2.5W @ 75°C
- Thermal Resistance Forced Air Flow: 12.60°C/W @ 200 LFM
- Thermal Resistance Natural: 29.57°C/W
- Material Finish: Tin
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- Datasheet: BRVN-HSS07-C20-P274
