HSS08-B18-CP
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BRVN:BRVN-HSS08-B18-CP
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MPN:HSS08-B18-CP
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MFR:
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Description:HEAT SINK, STAMPING, TO-218, 44.
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEAT SINK, STAMPING, TO-218, 44.
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSS
- Product Status: Active
- Type: Board Level, Vertical
- Material: Aluminum Alloy
- Shape: Square
- Package Cooled: TO-218
- Attachment Method: PC Pin
- Width: 1.750" (44.45mm)
- Diameter: -
- Fin Height: 0.492" (12.50mm)
- Power Dissipation Temperature Rise: 10.3W @ 75°C
- Thermal Resistance Forced Air Flow: 3.50°C/W @ 200 LFM
- Thermal Resistance Natural: 7.29°C/W
- Material Finish: Black Anodized
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- Datasheet: BRVN-HSS08-B18-CP
