HSS11-B20-P38

  • BRVN:
    BRVN-HSS11-B20-P38
  • MPN:
    HSS11-B20-P38
  • MFR:
  • Description:
    HEAT SINK, STAMPING, TO-220, 50.
Datasheet

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  • Description: HEAT SINK, STAMPING, TO-220, 50.
  • Manufacturer: CUI Devices
  • Length: 0 mm
  • Series: HSS
  • Product Status: Active
  • Type: Board Level, Vertical
  • Material: Aluminum Alloy
  • Shape: Rectangular
  • Package Cooled: TO-220
  • Attachment Method: Bolt On and PC Pin
  • Width: 1.260" (32.00mm)
  • Diameter: -
  • Fin Height: 0.500" (12.70mm)
  • Power Dissipation Temperature Rise: 4.8W @ 75°C
  • Thermal Resistance Forced Air Flow: 6.90°C/W @ 200 LFM
  • Thermal Resistance Natural: 15.76°C/W
  • Material Finish: Black Anodized