HSS14-B20-NP
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BRVN:BRVN-HSS14-B20-NP
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MPN:HSS14-B20-NP
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MFR:
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Description:HEAT SINK, STAMPING, TO-220, 19.


Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
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- Description: HEAT SINK, STAMPING, TO-220, 19.
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSS
- Product Status: Active
- Type: Board Level, Vertical
- Material: Aluminum Alloy
- Shape: Rectangular
- Package Cooled: TO-220
- Attachment Method: -
- Width: 0.750" (19.05mm)
- Diameter: -
- Fin Height: 0.157" (4.00mm)
- Power Dissipation Temperature Rise: 3.1W @ 75°C
- Thermal Resistance Forced Air Flow: 11.60°C/W @ 200 LFM
- Thermal Resistance Natural: 23.91°C/W
- Material Finish: Black Anodized
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- Datasheet: BRVN-HSS14-B20-NP