HSS23-B20-NP

  • BRVN:
    BRVN-HSS23-B20-NP
  • MPN:
    HSS23-B20-NP
  • MFR:
  • Description:
    HEAT SINK, STAMPING, TO-218/TO-2
Datasheet

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  • Description: HEAT SINK, STAMPING, TO-218/TO-2
  • Manufacturer: CUI Devices
  • Length: 0 mm
  • Series: HSS
  • Product Status: Active
  • Type: Top Mount
  • Material: Aluminum Alloy
  • Shape: Rectangular, Fins
  • Package Cooled: TO-218, TO-220
  • Attachment Method: Bolt On
  • Width: 1.496" (38.00mm)
  • Diameter: -
  • Fin Height: 0.787" (20.00mm)
  • Power Dissipation Temperature Rise: 7.36W @ 75°C
  • Thermal Resistance Forced Air Flow: 5.00°C/W @ 200 LFM
  • Thermal Resistance Natural: 10.19°C/W
  • Material Finish: Black Anodized