HSS25-B20-P51
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BRVN:BRVN-HSS25-B20-P51
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MPN:HSS25-B20-P51
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MFR:
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Description:HEAT SINK, STAMPING, TO-218/TO-2
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEAT SINK, STAMPING, TO-218/TO-2
- Manufacturer: CUI Devices
- Length: 0 mm
- Series: HSS
- Product Status: Active
- Type: Board Level
- Material: Aluminum Alloy
- Shape: Square, Fins
- Package Cooled: TO-218, TO-220
- Attachment Method: PC Pin
- Width: 1.000" (25.40mm)
- Diameter: -
- Fin Height: 1.673" (42.50mm)
- Power Dissipation Temperature Rise: 5.88W @ 75°C
- Thermal Resistance Forced Air Flow: 6.30°C/W @ 200 LFM
- Thermal Resistance Natural: 12.75°C/W
- Material Finish: Black Anodized
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- Datasheet: BRVN-HSS25-B20-P51
