HSS28-B20-P39

  • BRVN:
    BRVN-HSS28-B20-P39
  • MPN:
    HSS28-B20-P39
  • MFR:
  • Description:
    HEAT SINK, STAMPING, TO-218/TO-2
Datasheet

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  • Description: HEAT SINK, STAMPING, TO-218/TO-2
  • Manufacturer: CUI Devices
  • Length: 0 mm
  • Series: HSS
  • Product Status: Active
  • Type: Board Level
  • Material: Aluminum Alloy
  • Shape: Square, Fins
  • Package Cooled: TO-218, TO-220
  • Attachment Method: Bolt On and PC Pin
  • Width: 0.748" (19.00mm)
  • Diameter: -
  • Fin Height: 0.374" (9.50mm)
  • Power Dissipation Temperature Rise: 2.71W @ 75°C
  • Thermal Resistance Forced Air Flow: 12.00°C/W @ 200 LFM
  • Thermal Resistance Natural: 27.66°C/W
  • Material Finish: Black Anodized