IC-316-SGG
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BRVN:BRVN-IC-316-SGG
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MPN:IC-316-SGG
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MFR:
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Description:CONN IC DIP SOCKET 16POS GOLD
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: CONN IC DIP SOCKET 16POS GOLD
- Manufacturer: Samtec
- Length: 0 mm
- Series: IC
- Product Status: Obsolete
- Mounting Type: Through Hole
- Termination: Solder
- Features: Open Frame
- Operating Temperature: -55°C ~ 125°C
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Housing Material: Polyester, Glass Filled
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Phosphor Bronze
