V-1102-SMD/A-L
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BRVN:BRVN-V-1102-SMD/A-L
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MPN:V-1102-SMD/A-L
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MFR:
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Description:HEATSINK TO-263 19.38X25.40MM
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEATSINK TO-263 19.38X25.40MM
- Manufacturer: ASSMANN WSW Componets
- Length: 0 mm
- Series: -
- Product Status: Active
- Type: Top Mount
- Material: Copper
- Package Cooled: TO-263 (D²Pak)
- Attachment Method: SMD Pad
- Shape: Rectangular, Fins
- Width: 1.000" (25.40mm)
- Diameter: -
- Fin Height: 0.450" (11.43mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM
- Thermal Resistance @ Natural: 11.00°C/W
- Material Finish: Tin
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- Datasheet: BRVN-V-1102-SMD/A-L
