V2199N1-F
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BRVN:BRVN-V2199N1-F
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MPN:V2199N1-F
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MFR:
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Description:HEATSINK CPU W/ADHESIVE STAMPED
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Import Tariff May Apply
Import Tariff may apply to this part if shipping to the United States.
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- Description: HEATSINK CPU W/ADHESIVE STAMPED
- Manufacturer: ASSMANN WSW Componets
- Length: 0 mm
- Series: -
- Product Status: Active
- Type: Top Mount
- Material: Aluminum Alloy
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Rectangular, Fins
- Width: 0.866" (22.00mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material Finish: Natural Anodized
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- Datasheet: BRVN-V2199N1-F
