V2199N1-F

Datasheet

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  • Description: HEATSINK CPU W/ADHESIVE STAMPED
  • Manufacturer: ASSMANN WSW Componets
  • Length: 0 mm
  • Series: -
  • Product Status: Active
  • Type: Top Mount
  • Material: Aluminum Alloy
  • Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
  • Attachment Method: Thermal Tape, Adhesive (Included)
  • Shape: Rectangular, Fins
  • Width: 0.866" (22.00mm)
  • Diameter: -
  • Fin Height: 0.394" (10.00mm)
  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: -
  • Thermal Resistance @ Natural: -
  • Material Finish: Natural Anodized